july 2011 doc id 9474 rev 5 1/10 10 stps3150 power schottky rectifier features negligible switching losses low forward voltage drop for higher efficiency and extented battery life low thermal resistance ecopack ? 2 compliant component description 150 v power schottky rectifier are suited for switch mode power supplies on up to 24 v rails and high frequency converters. packaged in axial, smb, and low-profile smb, this device is intended for use in consumer and computer applications like tv, stb, pc and dvd where low drop forward voltage is required to reduce power dissipation. table 1. device summary symbol value i f(av) 3 a v rrm 150 v t j (max) 175 c v f (max) 0.67 v k a k a k a smb stps3150u do-201ad stps3150 smb flat stps3150uf www.st.com
characteristics stps3150 2/10 doc id 9474 rev 5 1 characteristics to evaluate the conduction losses use the following equation: p = 0.59 x i f(av) + 0.023 i f 2 (rms) table 2. absolute ratings (limiting values) symbol parameter value unit v rrm repetitive peak reverse voltage 150 v i f(av) average forward current smb t l = 130 c = 0.5 3 a do-201ad t l = 140 c = 0.5 smb flat t l = 150 c = 0.5 i fsm surge non repetitive forward current smb t p = 10 ms sinusoidal 80 a do-201ad 100 smb flat 80 t stg storage temperature range -65 to + 175 c t j operating junction temperature (1) 1. condition to avoid thermal runaway for a diode on its own heatsink 175 c table 3. thermal resistance symbol parameter value unit r th(j-l) junction to lead smb flat 10 c/w smb 20 lead length = 10 mm do-201ad 15 table 4. static electrical characteristics symbol parameter tests conditions min. typ. max. unit i r (1) 1. t p = 5 ms, < 2% reverse leakage current t j = 25 c v r = v rrm 0.4 2.0 a t j = 125 c 0.6 2.0 ma v f (2) 2. t p = 380 s, < 2% forward voltage drop t j = 25 c i f = 3 a 0.78 0.82 v t j = 125 c 0.63 0.67 t j = 25 c i f = 6 a 0.85 0.89 t j = 125 c 0.70 0.75 dptot dtj --------------- 1 rth j a ? () ------------------------- - <
stps3150 characteristics doc id 9474 rev 5 3/10 figure 1. average forward power dissipation versus average forward current figure 2. average forward current versus ambient temperature ( = 0.5) (do-201ad / smb) p (w) f(av) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 i (a) f(av) t =tp/t tp = 1 = 0.5 = 0.05 = 0.1 = 0.2 i (a) f(av) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 25 50 75 100 125 150 175 t =tp/t tp t (c) amb r =75c/w th(j-a) r=r th(j-a) th(j-i) do-201ad smb figure 3. average forward current versus ambient temperature ( = 0.5) (smb flat) figure 4. non repetitive surge peak forward current versus overload duration (maximum values) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 25 50 75 100 125 150 175 smb flat t (c) amb r=r th(j-a) th(j-l) t =tp/t tp r =40c/w . s =2.5 cm th(j-a) cu 2 i (a) f(av) i (a) m 0 1 2 3 4 5 6 7 8 9 10 11 12 1.e-03 1.e-02 1.e-01 1.e+00 i m t =0.5 t(s) t =25c a t =75c a t =125c a smb figure 5. non repetitive surge peak forward current versus overload duration (maximum values) figure 6. non repetitive surge peak forward current versus overload duration (maximum values) i (a) m 0 2 4 6 8 10 12 14 1.e-03 1.e-02 1.e-01 1.e+00 i m t =0.5 t(s) t =25c a t =75c a t =125c a do-201ad 0 5 10 15 20 25 30 35 40 45 50 1.e-03 1.e-02 1.e-01 1.e+00 smb flat t =25c l t =75c l t =125c l i (a) m i m t =0.5 t(s)
characteristics stps3150 4/10 doc id 9474 rev 5 figure 7. normalized avalanche power derating versus pulse duration figure 8. normalized avalanche power derating versus junction temperature 0.001 0.01 0.1 0.01 1 0.1 10 100 1000 1 p(t p ) p (1s) arm arm t (s) p 0 0.2 0.4 0.6 0.8 1 1.2 25 50 75 100 125 150 p(t) p (25 c) arm j arm t (c) j figure 9. relative variation of thermal impedance junction to ambient versus pulse duration figure 10. relative variation of thermal impedance junction to ambient versus pulse duration 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 z/r th(j-a) th(j-a) t =tp/t tp t (s) p smb single pulse 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 z/r th(j-a) th(j-a) t =tp/t tp t (s) p do-201ad single pulse figure 11. relative variation of thermal impedance junction to lead versus pulse duration figure 12. reverse leakage current versus reverse voltage applied (typical values) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 z/r th(j-l) th(j-l) smb flat t (s) p single pulse i (a) r 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 1.e+04 0 25 50 75 100 125 150 v (v) r t =125c j t =150c j t =100c j t =50c j t =25c j t =75c j
stps3150 characteristics doc id 9474 rev 5 5/10 figure 17. thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board copper thickness = 35 m) figure 13. junction capacitance versus reverse voltage applied (typical values) figure 14. forward voltage drop versus forward current c(pf) 10 100 1000 1 10 100 1000 f=1mhz v =30mv t =25c osc rms j v (v) r i (a) fm 1 10 100 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 v (v) fm t =25c (maximum values) j t =125c (typical values) j t =125c (maximum values) j figure 15. thermal resistance junction to ambient versus copper surface under each lead figure 16. thermal resistance junction to ambient versus copper surface under each lead r (c/w) th(j-a) 0 10 20 30 40 50 60 70 80 90 100 110 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 s (cm2) cu smb epoxy printed board copper thickness = 35 m r th (c/w) 0 10 20 30 40 50 60 70 80 90 5 10152025 r th(j-i) r th(j-a) l (mm) leads do-201ad epoxy printed board copper thickness = 35 m 0 10 20 30 40 50 60 70 80 90 100 110 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 s (cm2) cu smb flat r (c/w) th(j-a)
package information stps3150 6/10 doc id 9474 rev 5 2 package information epoxy meets ul94, v0 lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 18. smb footprint (dimensions in mm) table 5. smb dimensions ref. dimensions millimeters inches min. max. min. max. a1 1.90 2.45 0.075 0.096 a2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 e 5.10 5.60 0.201 0.220 e1 4.05 4.60 0.159 0.181 d 3.30 3.95 0.130 0.156 l 0.75 1.50 0.030 0.059 e c l e1 d a1 a2 b 2.60 5.84 1.62 2.18 1.62
stps3150 package information doc id 9474 rev 5 7/10 figure 19. smb flat footprint (dimensions in mm) table 6. smb flat dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.90 1.10 0.035 0.043 b (1) 1. applies to plated leads 1.95 2.20 0.077 0.087 c (1) 0.15 0.40 0.006 0.016 d 3.30 3.95 0.130 0.156 e 5.10 5.60 0.200 0.220 e1 4.05 4.60 0.189 0.181 l 0.75 1.50 0.029 0.059 l1 0.40 0.016 l2 0.60 0.024 d a l l l1 l2 e e1 b c 1.20 1.20 3.44 5.84 2.07
package information stps3150 8/10 doc id 9474 rev 5 table 7. do-201ad dimensions ref. dimensions millimeters inches min. max. min. max. a 9.50 0.374 b 25.40 1.000 c 5.30 0.209 d (1) 1. the lead diameter d is not controlled over zone e 1.30 0.051 e 1.25 0.049 note 2 (2) 2. the minimum length, which must stay straight bet ween the right angles after bending, is 15 mm (0.59?) 15 0.59 ?c ?d a ee note 2 note 1 note 1 bb
stps3150 ordering information doc id 9474 rev 5 9/10 3 ordering information 4 revision history table 8. ordering information order code marking package weight base qty delivery mode stps3150u g315 smb 0.107 g 2500 tape and reel stps3150uf fg315 smb flat 0.50 g 5000 tape and reel stps3150 stps3150 do-201ad 1.12 g 600 ammopack stps3150rl stps3150 do-201ad 1.12 g 1900 tape and reel table 9. document revision history date revision changes may-2003 2a last update. 31-may-2006 3 reformatted to current standard. added ecopack statement. updated smb footprint in figure 12. changed nf to pf in figure 8. 08-feb-2007 4 added smb flat and smb flat e package. 20-jul-2011 5 updated table 2.
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